Processing apparatus and device manufacturing method
US8441614B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2009 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Feb 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing apparatus of the present invention processes for a wafer 9. The processing apparatus includes an XY stage 6 which includes a wafer chuck 8 which holds the wafer 9 and an elevating device which rises relative to the wafer chuck 8 to hold the wafer 9, and a wafer conveying robot hand 14 which conveys the wafer 9 from the XY stage 6 at a wafer transfer position 18. The XY stage 6 moves to change a direction at an angle between 30 degree and 120 degree via the wafer transfer position 18 in a state where the elevating device rises relative to the wafer chuck 8. The wafer conveying robot hand 14 has a shape which does not interfere with the XY stage 6 which moves to change the direction at the angle when the wafer conveying hand 14 is positioned at the wafer transfer position 18.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.