System for cleaning components for filling holes in a printed circuit board with a fluid fill material
US8444770B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2009 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Dec 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material includes removing the components being a dispensing head and a manifold connected to the dispensing head preferably as a single unit. The single unit is retained in that format. Excess fluid material from the dispensing head and manifold is evacuated preferably by passing air through the dispensing head and manifold. Then the dispensing head and manifold is placed in a cleaning tub, and the manifold is attached to a solvent pump line. The dispensing head and manifold is flushed with a flow of solvent from the solvent pump line; and excess solvent from the dispensing head and manifold is evacuated, by passing air through the dispensing head and manifold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.