Micro-optical device packaging system

US8445984B2 · kind B2 · utility

Assignees

• TEXAS INSTRUMENTS INCORPORATED · US
• Amkor Technology, Inc. · US

Inventors

• Bradley Morgan Haskett · Allen, US
• John P. O'Connor · Wellesley, US
• Mark Myron Miller · Plano, US
• Sean T. Crowley · Phoenix, US
• Jeffrey Alan Miks · Chandler, US
• Mark Popovich · Tokyo, JP

Key dates

• Filing date: May 3, 2011
• Grant date: May 21, 2013
• Expiry date: May 3, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/804
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.