Wiring substrate and method for manufacturing the wiring substrate
US8446013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2011 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Sep 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a substrate body including a first substrate surface and a second substrate surface, a trench being open toward the first substrate surface, the trench having an inner bottom surface and an inner side surface, a through-hole having a first end communicating with the inner bottom surface of the trench and a second end being open toward the second substrate surface, a first conductive layer having a first surface toward the trench and being filled inside at least a portion of the through-hole from the second end, a second conductive layer covering the first surface and at least a part of the inner bottom surface of the trench, and a third conductive layer covering the second conductive layer and being filled inside the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.