Semiconductor module having an insert and method for producing a semiconductor module having an insert

US8446726B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Ralf Schloerke · Ottobeuren, DE
• Thilo Stolze · Arnsberg, DE

Key dates

• Filing date: Oct 28, 2010
• Grant date: May 21, 2013
• Expiry date: Jul 13, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.