Packages and methods for packaging MEMS microphone devices
US8447057B2 · kind B2 · utility
23Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2011 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Jul 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package substrate having an acoustic pathway therethrough that opens to an interior of the device. A MEMS microphone die having an integrated filter and a movable membrane is positioned within the interior of the device. The package substrate includes a conductive layer facing the interior of the device, and a package filter formed from the conductive layer is provided along the acoustic pathway, resulting in increased packaged MEMS microphone device yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.