Patent · US Active

Smart card module with flip-chip-mounted semiconductor chip

US8448868B2 · kind B2 · utility

9Cited by

4References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andreas Mueller-Hipper · Regensburg, DE
Frank Pueschner · Kelheim, DE

Key dates

Filing date	Nov 5, 2010
Grant date	May 28, 2013
Priority date	—
Expiry date	Mar 12, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A smart card module and a method for producing a smart card module are provided. The smart card module comprises a semiconductor chip having a contact side with a plurality of contacts, and a base material with at least one metal layer. The contact side of the semiconductor chip faces the base material and the plurality of contacts of the semiconductor chip are electrically connected to the metal layer. The semiconductor chip and at least a portion of the base material are covered with an encapsulation layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.