Semiconductor package
US8450825B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 30, 2010 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Mar 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.