Paresh Limaye
3Patents
2h-index
2Co-inventors
24Inventor score
Filing activity: Jul 7, 2010 → Dec 23, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8907471B2 | Window interposed die packaging | Electricity | 36 | Active |
| US9508665B2 | Method for insertion bonding and device thus obtained | Electricity | 5 | Active |
| US8450825B2 | Semiconductor package | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.