Apparatus for the optical inspection of wafers

US8451440B2 · kind B2 · utility

Assignee

• KLA-Tencor MIE GmbH · DE

Inventors

• Kurt Hahn · Gießen, DE
• Roland Hedrich · Ehringshausen, DE
• Gerhard Hoppen · Wetzlar, DE
• Lambert Danner · Wetzlar, DE
• Albert Kreh · Solms, DE
• Wolfgang Vollrath · Burbach, DE
• Alexander Büttner · Weilburg, DE
• Christof Krampe-Zadler · Castrop-Rauxel, DE
• Henning Backhauss · Wetzlar, DE
• Hermann Bittner · Limburg, DE

Key dates

• Filing date: Mar 3, 2010
• Grant date: May 28, 2013
• Expiry date: Oct 28, 2031

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2021/8825
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.