Apparatus for measuring and calibrating error of wafer prober
US8452563B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 11, 2008 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Jun 30, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45031
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is an error measurement and correction device of a stage of a wafer prober. The error measurement and correction device includes a jig member, a vision module, a central processing unit, and an interface unit. The jig member is disposed on a chuck on the stage, and the vision module is disposed on an upper plate of the wafer prober disposed at a position facing the jig member to enable the camera of the vision module to acquire images of the patterns of the jig member and transmits the acquired images to the central processing unit. The central processing unit acquires images of the patterns of the jig member disposed on the chuck by using the vision module to extract reference position information, moves the stage at a unit interval of the pattern, acquires images of the patterns of the jig member again to extract measured position information, and generates and stores mapping data by calculating difference between the measured position information and the reference position information. The central processing unit corrects the movement position information on the stage to be moved by using the mapping data when the stage is moved, so that irrespective of physical deterio…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.