Printed circuit board manufacturing method
US8453323B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2011 |
| Grant date | Jun 4, 2013 |
| Priority date | — |
| Expiry date | Oct 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.