Method for forming self-aligned phase-change semiconductor diode memory
US8455298B2 · kind B2 · utility
1Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2009 |
| Grant date | Jun 4, 2013 |
| Priority date | — |
| Expiry date | Aug 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/882
Abstract
A method for fabricating a memory device includes depositing a phase-change and/or a resistive change material. The memory device is formed photolithographically using sixteen or fewer masks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.