Methods and apparatus for assembling and operating electronic device manufacturing systems

US8455368B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Phil Chandler · San Francisco, US
• Daniel O. Clark · Pleasanton, US
• Robbert M. Vermeulen · Pleasant Hill, US
• Jay J. Jung · Shrewsbury, US
• Roger M. Johnson · Livermore, US
• Youssef A. Loldj · Sunnyvale, US
• James L. Smith · Chambersburg, US

Key dates

• Filing date: May 25, 2008
• Grant date: Jun 4, 2013
• Expiry date: Apr 17, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/53048
• WIPO field: Control
• WIPO sector: Instruments

Abstract

A method for operating one or more electronic device manufacturing systems is provided, including the steps 1) performing a series of electronic device manufacturing process steps with a process tool, wherein the process tool produces effluent as a byproduct of performing the series of process steps; 2) abating the effluent with an abatement tool; 3) supplying an abatement resource to the abatement tool from a first abatement resource supply; 4) changing an abatement resource supply from the first abatement resource supply to a second abatement resource supply, wherein changing the abatement resource supply comprises: i) interrupting a flow of the abatement resource from the first abatement resource supply; and ii) beginning a flow of the abatement resource from the second abatement resource supply; and 5) continuing to perform the series of process steps with the process tool, while changing, and after changing, the abatement resource supply.