Systems and methods for three dimensional sensors
US8459112B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2011 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Jun 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for fabricating a multi-axis sensor are provided. In one implementation, a method comprises: fabricating a first die having a first active surface with first application electronics; fabricating a second die having a second active surface with second application electronics and a plurality of electrical connections that extend from the second application electronics to a side surface interface of the second die that is adjacent to the second active surface; aligning the side surface interface to be coplanar with the first active surface; and forming at least one electrical connection between the plurality of electrical connections and the first active surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.