Ryan W. Rieger
5Patents
3h-index
7Co-inventors
42Inventor score
Filing activity: Nov 1, 2005 → Jun 9, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7564237B2 | Integrated 3-axis field sensor and fabrication methods | Emerging Cross-Sectional Technologies | 11 | Active |
| US7355389B2 | Method and system for linear positioning | Physics | 6 | Expired |
| US8459112B2 | Systems and methods for three dimensional sensors | Electricity | 3 | Active |
| US8703543B2 | Vertical sensor assembly method | Electricity | 3 | Active |
| US8316552B1 | Systems and methods for three-axis sensor chip packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.