Heater chips with silicon die bonded on silicon substrate, including offset wire bonding
US8459779B2 · kind B2 · utility
3Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2011 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Sep 24, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.