Self-aligned wafer bonding
US8460794B2 · kind B2 · utility
3Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2009 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Sep 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the substrate. A wafer apparatus including two wafers having complimentary hydrophilic regions and eutectic bonding material is disclosed and a method of forming a bonded wafer articles is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.