Method for manufacturing a transistor with parallel semiconductor nanofingers
US8460978B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2006 |
| Grant date | Jun 11, 2013 |
| Priority date | — |
| Expiry date | Dec 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6735
Abstract
A method of producing a transistor having parallel semiconductor nanofingers. The method includes: forming a monocrystalline layer of a semiconductor material on a layer of a subjacent material which can be selectively etched in relation to the monocrystalline layer; etching parallel partitions in the monocrystalline layer and in the subjacent layer and continuing said etching operation in order to hollow out part of the subjacent layer of material; filling the gap between the partitions and the hollowed-out part with a first insulating material; defining a central part of the partitions and removing the first insulating material from around the central part of the monocrystalline layer, thereby forming a finger of semiconductor material; and filling and coating the central part with a conductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.