Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
US8465615B2 · kind B2 · utility
5Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2011 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Dec 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2839
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.