Polymer layer removal on pzt arrays using a plasma etch
US8465659B2 · kind B2 · utility
2Cited by
2References
19Claims
0Family size
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Key dates
| Filing date | Jan 21, 2011 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Oct 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing a dielectric fill layer over the diaphragm and the plurality of piezoelectric elements to encapsulate the piezoelectric elements, curing the dielectric fill layer to form an interstitial layer, then removing the interstitial layer from an upper surface of the plurality of piezoelectric elements using a plasma etch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.