Patent · US Active

Trap rich layer for semiconductor devices

US8466036B2 · kind B2 · utility

109Cited by
17References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 7, 2011
Grant dateJun 18, 2013
Priority date
Expiry dateDec 7, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/1421
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An integrated circuit chip is formed with an active layer and a trap rich layer. The active layer is formed with an active device layer and a metal interconnect layer. The trap rich layer is formed above the active layer. In some embodiments, the active layer is included in a semiconductor wafer, and the trap rich layer is included in a handle wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.