Trap rich layer for semiconductor devices
US8466036B2 · kind B2 · utility
109Cited by
17References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2011 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Dec 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1421
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit chip is formed with an active layer and a trap rich layer. The active layer is formed with an active device layer and a metal interconnect layer. The trap rich layer is formed above the active layer. In some embodiments, the active layer is included in a semiconductor wafer, and the trap rich layer is included in a handle wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.