Patent · US Active

Method for producing a thin chip comprising an integrated circuit

US8466037B2 · kind B2 · utility

0Cited by

10References

18Claims

0Family size

Assignee

Institut für Mikroelektronik Stuttgart · DE

Inventors

Joachim Norbert Burghartz · Shrub Oak, US
Wolfgang Appel · Kelkheim, DE
Martin Zimmermann · Sasbach, DE

Key dates

Filing date	Sep 11, 2008
Grant date	Jun 18, 2013
Priority date	—
Expiry date	Jan 4, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/02002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a method for producing a very thin chip including an integrated circuit, a circuit structure is produced in a defined section of a semiconductor wafer. The defined wafer section is subsequently released from the semiconductor wafer. For this purpose, the wafer section is firstly freed such that it is held only via local web-like connections on the remaining semiconductor wafer, which web-like connections are arranged at a lateral periphery of the wafer section. The web-like connections are subsequently severed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.