Forming die backside coating structures with coreless packages
US8466559B2 · kind B2 · utility
9Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2010 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Apr 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.