Probe cards with minimized cross-talk
US8466704B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2010 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Apr 23, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31905
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test probe may have signal and ground probe pins. During testing of an integrated circuit die, the signal and ground probe pins may contact pads on the die. A printed circuit board may have conductive pads and traces that route signals between a tester and the probe pins. The probe pins may be supported by a ring-shaped conductive epoxy support structure. The ground probe pins may be uninsulated within the conductive epoxy support structure, so that the ground probe pins are grounded along their length to the support structure. The signal probe pins may be insulated within the support structure. Coaxial cable shielding may be provided on the signal pins between an outer wall portion of the support structure and the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.