Integrated circuit package with multiple dies and a synchronizer
US8468381B2 · kind B2 · utility
11Cited by
12References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2010 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Jul 1, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A package includes a first die and a second die. The dies are connected to each other through an interface. The interface is configured to transport both control signals and memory transactions. A synchronizer is provided on at least one of said first and second of said dies. The synchronizer is configured to cause any untransmitted control signal values to be transmitted across the interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.