Universal die detachment apparatus
US8470130B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2010 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Oct 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.