Method for fabricating a flip-chip semiconductor optoelectronic device
US8470621B2 · kind B2 · utility
14Cited by
1References
14Claims
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Key dates
| Filing date | Mar 11, 2010 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Oct 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
Abstract
A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.