Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate

US8471577B2 · kind B2 · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Daniel Stillman · San Jose, US
• James L. Oborny · Sachse, US
• William John Antheunisse · Rowlett, US
• Norman J. Armendariz · Plano, US
• Ramyanshu Datta · Austin, US
• Margaret Simmons-Matthews · Richardson, US
• Jeff West · Dallas, US

Key dates

• Filing date: Jun 11, 2010
• Grant date: Jun 25, 2013
• Expiry date: Sep 23, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1461
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of topside only dual-side testing of an electronic assembly includes providing a singulated through substrate via (TSV) die flip chip attached to a die support including a package substrate. The TSVs on the TSV die extend from its frontside to contactable TSV tips on its bottomside. The TSVs on the frontside of the TSV die are coupled to embedded topside substrate pads on a top surface of the ML substrate. The die support includes lateral coupling paths between at least a portion of the embedded topside substrate pads and lateral topside pads on a topside surface of the die support lateral to the die area. The contactable TSV tips are contacted with probes to provide a first topside connection to the TSVs, and the lateral topside pads are contacted with probes to provide a second topside connection. Dual-side testing across the electronic assembly is performed using the first and second topside connections.