Jeff West
4Patents
2h-index
25Co-inventors
44Inventor score
Filing activity: Jun 22, 2000 → Nov 3, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8471577B2 | Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate | Electricity | 4 | Active |
| US9793106B2 | Reliability improvement of polymer-based capacitors by moisture barrier | Electricity | 2 | Active |
| US6709974B2 | Method of preventing seam defects in isolated lines | Electricity | 2 | Expired |
| US6872665B1 | Process flow for dual damescene interconnect structures | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.