Circuit for detecting tier-to-tier couplings in stacked integrated circuit devices
US8471582B2 · kind B2 · utility
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8References
21Claims
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Assignee
Inventor
Key dates
| Filing date | Jan 27, 2009 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Dec 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06596
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A first semiconductor tier has a first tier-to-tier connector for detecting a tier-to-tier coupling in a stacked integrated circuit (IC) device. A second semiconductor tier has a second tier-to-tier connector configured to electrically couple to the first tier-to-tier connector. A tier-to-tier detection circuit electrically couples to the second tier-to-tier connector. The tier-to-tier detection circuit generates an output signal indicative of an electrical coupling between the first semiconductor tier and the second semiconductor tier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.