Package for micro-electro-mechanical acoustic transducer with improved double side mountable electrodes
US8472647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2009 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | May 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A surface mountable package includes a base and a cover with a cavity defined thereby, and an acoustic transducer unit received in the cavity. The cover includes a first metal ring to enclose the acoustic transducer unit. The base includes a second metal ring to press against the first metal ring in order to form a metal shielding area. First and second metal connecting paths are formed electrically connected to the metal shielding area and the acoustic transducer unit, respectively. Besides, two pairs of first and second surface mountable metal electrodes are electrically connected to the first and the second metal connecting paths, respectively. As a result, the package can be selectively double surface mountable to a user's circuit board via the metal electrodes of the base or the metal electrodes of the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.