MEMSensing Microsystems Co., Ltd.
2Patents
2Active
2Granted
40Portfolio score
Filing activity: Apr 1, 2009 → Oct 14, 2015 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9546089B1 | Pressure sensor and packaging method thereof | Electricity | 1 | Active |
| US8472647B2 | Package for micro-electro-mechanical acoustic transducer with improved double side mountable electrodes | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.