Method of fabricating a base layer circuit structure
US8474133B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | May 2, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of fabricating a base layer circuit structure are provided. One fabrication method includes: providing an alignment carrier having a support surface; forming a plurality of electrically conductive structures above the support surface of the alignment carrier; disposing a structural material around and physically contacting the side surfaces of the electrically conductive structures formed above the support surface, the structural material having an upper surface coplanar with or parallel to the upper surface of one or more of the electrically conductive structures; exposing, if covered, the upper surfaces of the electrically conductive structures to facilitate electrical connection to the structures; and separating the alignment carrier from the base layer circuit structure. The base layer circuit structure includes the plurality of electrically conductive structures and the structural material surrounding and physically contacting the electrically conductive structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.