Methods of evaporating metal onto a semiconductor wafer in a test wafer holder

US8481344B2 · kind B2 · utility

Assignee

• Skyworks Solutions, Inc. · US

Inventors

• Lam T. Luu · Moorpark, US
• Shiban K. Tiku · Camarillo, US
• Richard S. Bingle · Thousand Oaks, US
• Jens Albrecht Riege · Ojai, US
• Heather L. Knoedler · Newbury Park, US
• Daniel C. Weaver · Boulder, US

Key dates

• Filing date: Jul 8, 2011
• Grant date: Jul 9, 2013
• Expiry date: Jul 8, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68785
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Apparatus and methods for evaporating metal onto semiconductor wafers are disclosed. One such apparatus can include an evaporation chamber that includes a wafer holder, such as a dome, and a test wafer holder that is separate and spaced apart from the wafer holder. In certain implementations, the test wafer can be coupled to a cross beam supporting at least one shaper. A metal can be evaporated onto production wafers positioned in the wafer holder while metal is evaporated on a test wafer positioned in a test wafer holder. In some instances, the production wafers can be GaAs wafers. The test wafer can be used to make a quality assessment about the production wafers.