Aqueous acidic formulations for copper oxide etch residue removal and prevention of copper electrodeposition
US8481472B2 · kind B2 · utility
4Cited by
23References
13Claims
0Family size
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Key dates
| Filing date | Oct 6, 2009 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Jan 23, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A highly aqueous acidic cleaning composition for copper oxide etch removal from Cu-dual damascene microelectronic structures and wherein that composition prevents or substantially eliminates copper redeposition on the Cu-dual damascene microelectronic structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.