Patent · US Active

Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom

US8481859B2 · kind B2 · utility

16Cited by

24References

21Claims

0Family size

Assignee

ARIZONA BOARD OF REGENTS, A BODY CORPORATE OF THE STATE OF ARIZONA ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY · US

Inventors

Jesmin Haq · Milpitas, US
Scott Ageno · Phoenix, US
Douglas E. Loy · Chandler, US
Shawn Michael O'Rourke · Tempe, US
Robert Naujokaitis · Chandler, US

Key dates

Filing date	May 27, 2011
Grant date	Jul 9, 2013
Priority date	—
Expiry date	Jul 26, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31515
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.