Pad bonding employing a self-aligned plated liner for adhesion enhancement
US8482132B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2009 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Jul 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1306
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Two substrates are brought together and placed in a plating bath. In one embodiment, a conductive material is plated in microscopic cavities present at the interface between a first metal pad and a second metal pad to form at least one interfacial plated metal liner portion that adheres to a surface of the first metal pad and a surface of the second metal pad. In another embodiment, at least one metal pad is recessed relative to a dielectric surface before being brought together. The two substrates are placed in a plating bath and a conductive material is plated in the cavity between the first metal pad and the second metal pad to form a contiguous plated metal liner layer that adheres to a surface of the first metal pad and a surface of the second metal pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.