Patent · US Active

Method for producing a component and device having a component

US8482135B2 · kind B2 · utility

1Cited by

4References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Horst Theuss · Wenzenbach, DE
Albert Auburger · Regenstauf, DE
Jochen Dangelmaier · Beratzhausen, DE
Josef Hirtreiter · Bad Kötzting, DE

Key dates

Filing date	Jun 29, 2007
Grant date	Jul 9, 2013
Priority date	—
Expiry date	Oct 1, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49224
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.