Systems, methods and computer program products for forming photomasks with reduced likelihood of feature collapse, and photomasks so formed
US8484584B2 · kind B2 · utility
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19References
20Claims
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Key dates
| Filing date | Oct 26, 2011 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Oct 26, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/70
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
At least one pattern of a photomask is identified that has a likelihood of causing collapse of a microelectronic device feature that is formed using the photomask, due to surface tension of a solution that is applied to the feature during manufacture of the microelectronic device. The patterns of the photomask are then modified to reduce the likelihood of the collapse. The photomask may be formed and the photomask may be used to manufacture microelectronic devices. Related methods, systems, devices and computer program products are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.