Chip scale vacuum pump
US8485793B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 15, 2008 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Nov 11, 2030 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04B45/047
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A chip scale structure fabricated from known MEMS processes is provided including a pump actuator, a pump volume, pump membrane, a valve membrane, a valve aperture, and a valve actuator. The pump actuator may include a piezoelectric or piezoceramic disk. The valve actuator may be a piezoelectric or piezoceramic disk. A manifold plate with a valve aperture is disposed between the pump membrane and the valve membrane. One or more vacuum chambers are provided along a vacuum flow path or conduit in communication with the one or more vacuum chambers. The flow path comprises an inlet port and an outlet port where the inlet port is in communication with the separately provided vacuum environment. The outlet port is in commemoration with an external environment (e.g. non or lower-vacuum environment) for exhausting gases that are pulled from the separately provided vacuum environment to a separate location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.