Lead frame sheet
US8486540B2 · kind B2 · utility
0Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2011 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Sep 30, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12368
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame sheet made of an electrically conductive material has lead frames integrally formed on it. Spacing members also are formed from the sheet. A first one of the spacing members is proximal to a first longitudinal edge of the sheet and a second one of the spacing members is proximal to a second longitudinal edge of the sheet. The spacing members extend from an underside surface of the sheet and, in use, space the underside surface from a planar support such as a surface of a heating block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.