Semiconductor device comprising high-k metal gate electrode structures and precision eFuses formed in the active semiconductor material
US8486768B2 · kind B2 · utility
1Cited by
1References
20Claims
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Key dates
| Filing date | May 24, 2011 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Aug 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a complex semiconductor device, electronic fuses may be formed in the active semiconductor material by using a semiconductor material of reduced heat conductivity selectively in the fuse body, wherein, in some illustrative embodiments, the fuse body may be delineated by a non-silicided semiconductor base material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.