Patent · US Active

Method of embedding passive component within via

US8487446B2 · kind B2 · utility

1Cited by

3References

11Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Todd Myers · Gilbert, US
Nicolas R. Watts · Phoenix, US
Eric Palmer · Tempe, US
Jui Min Lim · Chandler, US

Key dates

Filing date	Apr 27, 2011
Grant date	Jul 16, 2013
Priority date	—
Expiry date	Apr 27, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49165
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.