Patent · US Active

Fluid cooling system

US8490681B2 · kind B2 · utility

1Cited by

10References

7Claims

0Family size

Assignee

DANFOSS SILICON POWER GMBH · DE

Inventors

Ronald Eisele · Surendorf, DE
Klaus Olesen · Skanderborg, DK

Key dates

Filing date	Mar 9, 2005
Grant date	Jul 23, 2013
Priority date	—
Expiry date	May 10, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldThermal processes and apparatus
WIPO sectorMechanical engineering

Abstract

The invention provides a fluid cooling system comprising a heat exchanger with an outer wall forming a chamber with an inlet and an outlet for circulating a heat exchange medium in the chamber. The chamber has an opening towards the component which is to be cooled, and to protect the component, the opening is closed by a flexible wall which is attached to the outer wall. To protect the cover and the component against overload, the flexible wall is attached to an inner wall inside the chamber. The cooling system could be applied to electronic systems, e.g. for cooling a DCB substrate or similar electronic components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.