Transport method for disk-shaped workpieces
US8491252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2010 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Feb 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transport method for disk-shaped semiconductor wafer workpieces has a horizontally movable transport arm with two elongated carrying elements at one end, for receiving the workpiece. A cassette which includes a comb structure at each side for receiving several workpieces, is inserted free of contact between two adjacent combs with workpieces therein for vertically lifting a workpiece. The carrying elements are disposed such that during a cassette engagement they are each positioned substantially adjacent and parallel to the comb structure along a comb, and in this region along and between two adjacent comb planes on one side of the cassette, a scanning beam is provided for workpiece acquisition. The scanning beam is relatively height-positionable with respect to the cassette and is tilted about a small angle with respect to the horizontal workpiece plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.