Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurry
US8491682B2 · kind B2 · utility
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3References
13Claims
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Key dates
| Filing date | Dec 27, 2008 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Apr 16, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed are abrasive particles, a method for manufacturing the abrasive particles, and a method for manufacturing a Chemical Mechanical Polishing (CMP) slurry. The method for manufacturing abrasive particles for the CMP slurry includes preparing a raw material precursor, drying the raw material precursor, and calcining the dried raw material precursor using a calcination furnace where a gas atmosphere having relatively less oxygen in comparison with an air atmosphere is created.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.