Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same
US8491982B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jan 19, 2011 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | May 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an apparatus for manufacturing a bonding structure, a bonding structure, and a method of fabricating the same. The bonding structure includes a pad including an upper surface with a first area, a ball adhered to the upper surface of the pad, and a wire extending from the ball. An adhesion surface of the ball adhered to the pad may have substantially the same shape as that of the upper surface of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.