Eunchul Ahn
7Patents
2h-index
12Co-inventors
40Inventor score
Filing activity: Sep 24, 2009 → Mar 4, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8053881B2 | Semiconductor package and method for manufacturing the same | Electricity | 8 | Active |
| US8815731B2 | Semiconductor package and method of fabricating the same | Electricity | 4 | Active |
| US8558400B2 | Semiconductor packages and methods of fabricating the same | Electricity | 2 | Active |
| US9035308B2 | Semiconductor package and method of fabricating the same | Electricity | 1 | Active |
| US8491982B2 | Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US8497569B2 | Package substrates and semiconductor packages having the same | Electricity | 0 | Active |
| US8759221B2 | Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.