Methods and apparatus for ex situ seasoning of electronic device manufacturing process components
US8492674B2 · kind B2 · utility
1Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2008 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Mar 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one aspect, a method of improving the performance of an electronic device manufacturing facility is provided, including the step of reducing the number of electronic device manufacturing component seasoning steps which are performed using production equipment, whereby the amount of electronic device manufacturing system downtime is reduced. Several other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.